InImpact: The Journal of Innovation Impact

Publisher Future Technology Press
Vol. 8 No. 2 KES Transactions on SDM II - Sustainable Design and Manufacturing 2015
Volume Editors KES International
Journal ISSN 2051-6002
Article TitleEffect of Glass Surface Roughness on Separation Energy in Low Temperature Ultrasonic Soldering
Primary AuthorErry Adesta, International Islamic University Malaysia
Other Author(s) M Mustafa; H Mohamad; Irfan Hilmy
Pages 51 - 60
Article ID sdm15-015
Publication Date 02-May-16

Giftware products combining pewter (Sn5Sb1.2Cu) and glass require good matching up for strong adhesive bonding. The possibility of joining the parts without good matching using ultrasonic soldering is commercially attractive. Ultrasonic soldering was applied to bond the two substrates using (Sn40Bi)0.5Al as solder alloy at temperature not exceeding 450 °C. All parameters were kept constant except for the glass surface roughness. Analyses were conducted on the effects of glass surface roughness on shear separation force and extension before fracture of solder joint. The separation force and extension before fracture were determined by subjecting the soldered specimen to tensile stress test. Effect on shear separation energy was derived by calculation. Separation energy of joint between glass and Sn5Sb1.2Cu based on ultrasonic soldering can be strengthened by increasing glass surface roughness.

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Remarks Paper presented at KES International Conference on Sustainable Design and Manufacturing, 12-14 April 2015
First date of publication in InImpact: 1 December 2015